SLTL GROUP
Wafer Dicing System
Semiconductor wafer processing system
PRECISION POWERS POSSIBILITIES
Ever since our incorporation, we have been making our own way through the domains and industries.
Product overview
Semiconductor wafer processing system
| Wave Length | 532 nm |
| Working Power | 8 – 15 Watt |
| CNC Table | 180 × 180 mm |
| Beam Spot | ≤20-25 µm (depend on optics config.) |
| Accuracy | ±2 µm |
| Power Supply | 230 VAC+/- 10%, Single Phase |
| Dimension | 1400 × 975 × 1700 mm (approx.) |
| Computer System | Intel® Core™ i3 based CPU or higher |
| Warm-up Time | < 5 minutes |
| Cooling Method | Water-cooled |
| Power Stability | ±5% |
| Polarization | Linear |
| Controller Interface | RS232/USB/Ethernet |
*Product specification and data are subject to change or vary without notice to improve reliability function or design.
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24*7 service support and technical assistance. You’re welcome to visit our office for other insights
E-30, Electronic Estate, G. I. D. C.,
Sector - 26, Gandhinagar - 382 028
Gujarat, India.
