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Technologie laser brevetée

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Hallmark Evoq

Introducing the Hallmark Evoq, the ultimate diamond machine for precision coring and slicing of lab-grown diamonds. With its cutting-edge technology and advanced features, the Hallmark Evoq offers unparalleled accuracy and efficiency in the production process.

Designed to meet the demands of the diamond industry, the Hallmark Evoq boasts a parallel and extremely narrow laser beam kerf, ensuring smooth and precise slices with excellent surface smoothness. This precision technology guarantees maximum production of slices, enhancing the value of each stone by maximizing the number of possible slices. This technology guarantees accuracy at its best, allowing for consistent and high-quality results with minimal human intervention.

With the integration of in-house software and updated technology, the Hallmark Evoq offers maximum productivity and efficiency. For those in the diamond industry seeking a state-of-the-art solution for coring and slicing lab-grown diamonds, the Hallmark Evoq is the epitome of excellence.

LA PRÉCISION OUVRE DES POSSIBILITÉS

Innovative Compact Green Laser System

Hallmark Evoq

Consistent Reliability

Ease Of Operation

High Quality Results

Negligible Loss

We Build Memorable Digital Experiences.

Ever since our incorporation, we have been making our own way through the domains and industries.

  • Features
  • Technical Specification

• BREAK FREE CORING :
Utilizing in-house software, the machine effectively guides the laser beam to perform break-free coring on rough CVD Diamond.

• ACHIEVING MINIMAL KERF WIDTH:
The slices obtained from coring the diamond have an incredibly thin width, maximizing the number of slices that can be obtained from a single stone.

• ATTAINING A FINE AND UNWRINKLED STRUCTURE:
The coring process ensures the smooth structure of the rough diamond, preparing it for further processing.

• EXEMPLARY ENGINEERING:
The machines are constructed by reputable engineers, ensuring reliability and enabling maximum productivity.

• OPTIMAL RESOURCE UTILIZATION:
By cutting the rough stone into extremely thin slices, the machine significantly reduces diamond wastage, ensuring efficient use of resources.

Laser Source 20 W
Laser Type EPDL
Wavelength nm 532
Beam Mode TEM00
Working Power watt Apr-18
CNC Table mm 170 * 170
Resolution micron 1
Repeatability micron 3
Accuracy micron 2
Drive Type AC SERVO
Z Axis Travel mm 50
Power Supply 1 Phase, 3.4 Amp
Power Consumption kW 0.81
Operating Environment
Temperature / Humidity °C/RH 20 – 30 / < 60%
Coolant Requirement lt/hr 02-Mar
Dimension mm 950 * 730 * 1390
Computer System Intel Core i3 based CPU or Higher

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      E-30, Electronic Estate, G. I. D. C.,
      Sector - 26, Gandhinagar - 382 028
      Gujarat, India